Stack-based Buffer Overflow in MSM Thermal Driver for Linux Kernel 3.x

CVE-2016-2063 · HIGH Severity

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

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